Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) announces the successful signing of an important contract with leading solar energy company, SunEdison, for the delivery and commissioning of DW288 water-based diamond wire saws. After an extensive on-site equipment evaluation process, SunEdison selected Meyer Burger’s unique diamond wire cutting technology for the production of its high performance mono-crystalline silicon solar wafers. With its environmentally friendly water-based cutting technology, the DW288 enables the production of high-quality ultra-thin wafers at twice the cutting speed compared to the standard slurry wafering process. This significantly increases wafer output and maximizes equipment capacity.
“With their unique competencies in the development of high-tech equipment and their profound process insights, Meyer Burger is an ideal partner to SunEdison”, stated Dave Ranhoff, President Solar Materials at SunEdison.
SunEdison is relying on Meyer Burger’s diamond wire technology to help increase their wafering capacity to meet growing global demand for high performance, cost effective solar panels.
Michael Escher, CCO Meyer Burger, said: “This contract represents a further milestone in Meyer Burger’s endeavors to support the technology change within the industry. We are proud to work with SunEdison as a long-term partner sharing a common commitment to the development of the renewable energy market. This achievement underlines our commitment and dedication to providing advanced high-tech solutions to leading companies in high-growth industries”.
Delivery of the production equipment is scheduled to begin in the second quarter of 2015 with production at the customer’s site scheduled to begin in the second half of 2015.
Contact:
Werner Buchholz
Head of Corporate Communications
Phone +41 (0)33 221 25 06
werner.buchholz@meyerburger.com
Ingrid Carstensen
Corporate Communications
Phone +41 (0)33 221 28 34
ingrid.carstensen@meyerburger.com
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