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Meyer Burger Technology AG

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Ad hoc news News vom 15.05.2018

Meyer Burger awarded two contracts for its DS 261 wire saws for about CHF 17.5 million from existing customers in the semiconductor industry
 
Meyer Burger
 

Press Release

Thun, 15 May 2018

 
Meyer Burger awarded two contracts for its DS 261 wire saws for about CHF 17.5 million from existing customers in the semiconductor industry
 

Meyer Burger Technology Ltd (SIX Swiss Exchange: MBTN) today announced the successful conclusion of repeat orders from two existing customers for its versatile DS 261 wire saw equipment for slicing and wafering applications in the semiconductor industry.

 

In response to the strong growing global demand for semi-wafers, the customers, global manufacturers in the semiconductor industry, are expanding their production capacity. The strategic selection of Meyer Burger’s DS 261 cutting equipment is based on their excellent experience with Meyer Burger’s technology from previous projects. It also underscores the customers’ confidence in Meyer Burger’s in-depth expertise in precision cutting technologies which enable the production of semiconductor wafers with outstanding surface qualities.

 

The total contractual value of both orders is about CHF 17.5 million. The orders comprise the installation, on-site training and service of the DS 261 wire saw equipment. Delivery of the equipment is scheduled to begin in the first half of 2019.

 

 

 

Contacts:

Ingrid Carstensen

Head of Corporate Communications

Phone +41 (0)33 221 28 34

[email protected]

 

Daniel Eicher

c/o Tolxdorff Eicher Häberling

Phone +41 (0)33 221 28 83

[email protected]

 
 
 
Press Release